Boo Jung: search on Z-Library

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1

Improved electrochromic properties of nanoporous NiO film by NiO flake with thickness controlled by aluminum

Yang, Hyeeun, Yu, Jung-Hoon, Seo, Hyeon Jin, Jeong, Rak Hyun, Boo, Jin-Hyo

Journal:

Applied Surface Science

Year:

2018

Language:

english

File:

PDF, 1.20 MB

english, 2018

2

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Jeong, Haksan, Myung, Woo-Ram, Sung, Yong-Gue, Kim, Kyung-Yeol, Jung, Seung-Boo

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2018

Language:

english

File:

PDF, 4.58 MB

english, 2018

3

GIS as a tool for processing hybrid prospection data in landscape archaeology

BOOS, SILKE, HORNUNG, SABINE, JUNG, PATRICK, MÜLLER, HARTMUT

Journal:

International Journal of Humanities and Arts Computing

Year:

2007

Language:

english

File:

PDF, 1.20 MB

english, 2007

4

Coupled vibration analysis of Maglev vehicle-guideway while standing still or moving at low speeds

Kim, Ki-Jung, Han, Jong-Boo, Han, Hyung-Suk, Yang, Seok-Jo

Journal:

Vehicle System Dynamics

Year:

2015

Language:

english

File:

PDF, 1.24 MB

english, 2015

5

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 452 KB

english, 2007

6

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.76 MB

english, 2008

7

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Sung, Yong-Gue, Myung, Woo-Ram, Jeong, Haksan, Ko, Min-Kwan, Moon, Jeonghoon, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 1.26 MB

english, 2018

8

Characterization of Reliability of Printed Indium Tin Oxide Thin Films

Hong, Sung-Jei, Kim, Jong-Woong, Jung, Seung-Boo

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2013

Language:

english

File:

PDF, 354 KB

english, 2013

9

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications

Kim, Dae Up, Kim, Kwang-Seok, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

10

Bending reliability of NiâMWCNT composite solder with a differential structure

Lee, Choong-Jae, Hwang, Byeong-Uk, Min, Kyung Deuk, Kim, Jae-Ha, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 7.95 MB

2020

11

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.57 MB

english, 2007

12

Surface finishes of rolled copper foil for flexible printed circuit board

Chang-Yong Lee, Won-Chul Moon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 861 KB

english, 2008

13

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 905 KB

english, 2008

14

Breast Cancer Screening With Mammography Plus Ultrasonography or Magnetic Resonance Imaging in Women 50 Years or Younger at Diagnosis and Treated With Breast Conservation Therapy

Cho, Nariya, Han, Wonshik, Han, Boo-Kyung, Bae, Min Sun, Ko, Eun Sook, Nam, Seok Jin, Chae, Eun Young, Lee, Jong Won, Kim, Sung Hun, Kang, Bong Joo, Song, Byung Joo, Kim, Eun-Kyung, Moon, Hee Jung, Ki

Journal:

Year:

2017

Language:

english

File:

PDF, 244 KB

english, 2017

15

Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

Kim, Jungsoo, Myung, Woo-Ram, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.03 MB

english, 2016

16

[American Society of Civil Engineers GeoHunan International Conference 2011 - Hunan, China (June 9-11, 2011)] Emerging Technologies for Material, Design, Rehabilitation, and Inspection of Roadway Pavements - Application of RDD Continuous Profiling in Maintenance and Rehabilitation of Concrete Pavements

Nam, Boo H., Lee, Jeffrey L., Stokoe, II, Kenneth H., Chen, Dar-Hao, Jung-Su, Lee

Year:

2011

Language:

english

File:

PDF, 1.49 MB

english, 2011

17

Chloroprene rubber modified by nanosilica for performance adhesion strength

Lim, Gyeong Eun, Park, KuenByeol, Cheon, Jung Mi, Jeong, Boo Young, Choi, Min Ji, Lee, Su-kyung, Lee, Won-Ki, Jang, Ki Deog, Chun, Jae Hwan

Journal:

Molecular Crystals and Liquid Crystals

Year:

2018

Language:

english

File:

PDF, 838 KB

english, 2018

18

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 319 KB

english, 2007

19

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.09 MB

english, 2008

20

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 4.55 MB

english, 2015

21

Identification and Characterization of Diploid and Tetraploid inPlatycodon grandiflorum

Shin, Jeoung-Hwa, Ahn, Yun Gyong, Jung, Ju-Hee, Woo, Sun-Hee, Kim, Hag-Hyun, Gorinstein, Shela, Boo, Hee-Ock

Journal:

Plant Foods for Human Nutrition

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

22

Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure

Shin, Hyeong-Won, Jung, Seung-Boo, Lee, Hyo-Soo

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 2.77 MB

english, 2018

23

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung, Woo-Ram, Kim, Yongil, Kim, Kyung-Yeol, Jung, Seung-Boo

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.98 MB

english, 2016

24

Thyroid Lymphoma

Nam, Meeyoung, Shin, Jung Hee, Han, Boo-Kyung, Ko, Eun Young, Ko, Eun Sook, Hahn, Soo Yeon, Chung, Jae Hoon, Oh, Young Lyun

Journal:

Journal of Ultrasound in Medicine

Year:

2012

Language:

english

File:

PDF, 1.64 MB

english, 2012

25

Cogging torque and acoustic noise reduction in permanent magnet motors by teeth pairing

Sang-Moon Hwang,, Jae-Boo Eom,, Geun-Bae Hwang,, Weui-Bong Jeong,, Yoong-Ho Jung,

Journal:

IEEE Transactions on Magnetics

Year:

2000

Language:

english

File:

PDF, 107 KB

english, 2000

26

Various design techniques to reduce cogging torque by controlling energy variation in permanent magnet motors

Sang-Moon Hwang,, Jae-Boo Eom,, Yoong-Ho Jung,, Deug-Woo Lee,, Beom-Soo Kang,

Journal:

IEEE Transactions on Magnetics

Year:

2001

Language:

english

File:

PDF, 118 KB

english, 2001

27

Synthesis of Poly(methylene oxy-alt PPO)glycols and Its Effect on the Properties of Polyurethane UV-Cured Film

Chun, Jae Hwan, Cheon, Jung Mi, Jeong, Boo Young, Jo, Nam Ju

Journal:

Molecular Crystals and Liquid Crystals

Year:

2014

Language:

english

File:

PDF, 211 KB

english, 2014

28

Design and fabrication of screen-printed silver circuits for stretchable electronics

Kim, Kwang-Seok, Jung, Kwang-Ho, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.52 MB

english, 2014

29

UV-responsive pressure sensitive adhesive for damage-free fabrication of ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Kim, Sang-Woo, Ju, Yun Hee, Han, Sangmoon, Kim, Jin-Soo, Lee, Hee-Jin, Han, Chul jong, Lee, Cheul-Ro, Jung, Seung-Boo, Kim, Youngmin, Kim, Jong-Woong

Journal:

Journal of Materials Chemistry A

Year:

2019

File:

PDF, 1.67 MB

2019

30

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Surface and Interface Analysis

Year:

2018

Language:

english

File:

PDF, 1.40 MB

english, 2018

31

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2007

Language:

english

File:

PDF, 673 KB

english, 2007

32

UV-responsive pressure sensitive adhesive for damage-free fabrication of ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Kim, Sang-Woo, Ju, Yun Hee, Han, Sangmoon, Kim, Jin-Soo, Lee, Hee-Jin, Han, Chul jong, Lee, Cheul-Ro, Jung, Seung-Boo, Kim, Youngmin, Kim, Jong-Woong

Journal:

Journal of Materials Chemistry A

Year:

2019

Language:

english

File:

PDF, 1.67 MB

english, 2019

33

Clinical nurses’ knowledge and practice of venous thromboembolism risk assessment and prevention in South Korea: A cross-sectional survey

Oh, Hyunjin, Boo, Sunjoo, Lee, Jung-Ah

Journal:

Journal of Clinical Nursing

Year:

2016

Language:

english

File:

PDF, 155 KB

english, 2016

34

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 5.80 MB

english, 2019

35

Reliability evaluations of flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 388 KB

english, 2005

36

Overshoot elimination of the evaporator wall temperature of a loop heat pipe through a bypass line

Jung, Eui Guk, Boo, Joon Hong

Journal:

Applied Thermal Engineering

Year:

2020

Language:

english

File:

PDF, 1.67 MB

english, 2020

37

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 774 KB

english, 2008

38

Hydrogenated amorphous and crystalline SiC thin films grown by RF-PECVD and thermal MOCVD; comparative study of structural and optical properties

C.-K. Jung, D.-C. Lim, H.-G. Jee, M.-G. Park, S.-J. Ku, K.-S. Yu, B. Hong, S.-B. Lee, J.-H. Boo

Journal:

Surface and Coatings Technology

Year:

2002

Language:

english

File:

PDF, 870 KB

english, 2002

39

Longitudinal validation of the Fear-Avoidance Beliefs Questionnaire (FABQ) in a Swiss-German sample of low back pain patients

Ralph Staerkle, Anne F. Mannion, Achim Elfering, Astrid Junge, Norbert K. Semmer, Nicola Jacobshagen, Dieter Grob, Jiri Dvorak, Norbert Boos

Journal:

European Spine Journal

Year:

2004

Language:

english

File:

PDF, 167 KB

english, 2004

40

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2005

Language:

english

File:

PDF, 634 KB

english, 2005

41

Synthesis of carbon nanotubes grown by hot filament plasma-enhanced chemical vapor deposition method

Jung, Kyung Ho, Boo, Jin-Hyo, Hong, Byungyou

Journal:

Diamond and Related Materials

Year:

2004

Language:

english

File:

PDF, 1.92 MB

english, 2004

42

Analysis of the Maillard reaction in human hair using Fourier transform infrared spectroscopic imaging and a focal-plane array detector

Jung, In-Keun, Park, Sang-Chul, Bin, Sung-Ah, Roh, Young Sup, Lee, John Hwan, Kim, Boo-Min

Journal:

Analytical and Bioanalytical Chemistry

Year:

2016

File:

PDF, 3.09 MB

2016

43

The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

Myung, Woo-Ram, Kim, Kyung-Yeol, Kim, Yongil, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 1.87 MB

english, 2017

44

A numerical modeling for the steady-state performance of a micro heat pipe using thin liquid film theory

Jung, Eui Guk, Boo, Joon Hong

Journal:

International Journal of Heat and Mass Transfer

Year:

2018

Language:

english

File:

PDF, 1.49 MB

english, 2018

45

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging

Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-Won

Year:

2018

Language:

english

File:

PDF, 238 KB

english, 2018

46

Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 717 KB

english, 2006

47

Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 523 KB

english, 2011

48

Longitudinal validation of the Fear-Avoidance Beliefs Questionnaire (FABQ) in a Swiss-German sample of low back pain patients

Ralph Staerkle, Anne F. Mannion, Achim Elfering, Astrid Junge, Norbert K. Semmer, Nicola Jacobshagen, Dieter Grob, Jiri Dvorak, Norbert Boos

Journal:

European Spine Journal

Year:

2007

Language:

english

File:

PDF, 85 KB

english, 2007

49

Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

Dae-Gon Kim, Hyung-Sun Jang, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2005

Language:

english

File:

PDF, 857 KB

english, 2005

50

Thermal numerical model of a high temperature heat pipe heat exchanger under radiation

Jung, Eui Guk, Boo, Joon Hong

Journal:

Year:

2014

Language:

english

File:

PDF, 1.27 MB

english, 2014

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